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B660B-0.0055-00-1112-NA

B660B-0.0055-00-1112-NA

Part Number
B660B-0.0055-00-1112-NA
Manufacturer
Bergquist
Description
THERM PAD 304.8MMX279.4MM W/ADH
Data sheet
B660B-0.0055-00-1112-NA.pdf
Category
Thermal - Pads, Sheets
Family
Series
Bond-Ply® 660B

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Comments
    • Buy the B660B-0.0055-00-1112-NA Bergquist on Chip-Max Electronics（HongKong) Co.,Limited,we are Bergquist Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the B660B-0.0055-00-1112-NA within 24 hours,please contact our sales team or send email to sundy@chip-max.com Hope we can cooperate in the future.
    Specifications
    SeriesBond-Ply® 660B
    RoHSRoHS
    TypeSheet, Tape
    ColorWhite
    ShapeRectangular
    Usage-
    Outline304.80mm x 279.40mm
    AdhesiveAdhesive - Both Sides
    MaterialNon-Silicone, Polyethylene-Naphthalate (PEN)
    Thickness0.0055" (0.140mm)
    Part StatusActive
    Backing, CarrierPolyethylene-Naphthalate (PEN)
    Thermal Resistivity0.58°C/W
    Thermal Conductivity0.4W/m-K
    RFQ Email
    sundy@chip-max.com or Inquires online
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