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GP3004SF-0.016-01-0918 GP3004SF-0.016-01-0918

GP3004SF-0.016-01-0918

Part Number
GP3004SF-0.016-01-0918
Manufacturer
Bergquist
Description
BERGQUIST GAP PAD TGP 3004SF
Data sheet
GP3004SF-0.016-01-0918.pdf
Category
Thermal - Pads, Sheets
Family
Series
Gap Pad® 3004SF

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Comments
    • Buy the GP3004SF-0.016-01-0918 Bergquist on Chip-Max Electronics（HongKong) Co.,Limited,we are Bergquist Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the GP3004SF-0.016-01-0918 within 24 hours,please contact our sales team or send email to sundy@chip-max.com Hope we can cooperate in the future.
    Specifications
    SeriesGap Pad® 3004SF
    RoHSRoHS
    TypeGap Filler Pad, Sheet
    ColorGray
    ShapeRectangular
    UsageThermally Conductive
    Outline457.20mm x 228.60mm
    AdhesiveTacky - Both Sides
    MaterialNon-Silicone
    Thickness0.0160" (0.406mm)
    Part StatusActive
    Backing, CarrierFiberglass
    Thermal Resistivity-
    Thermal Conductivity3.0W/m-K
    RFQ Email
    sundy@chip-max.com or Inquires online
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