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TH832-288-192-0.5 TH832-288-192-0.5

TH832-288-192-0.5

Part Number
TH832-288-192-0.5
Manufacturer
Penchem Technologies Sdn Bhd
Description
SOFT SILICONE THERMAL PAD
Data sheet
Category
Thermal - Pads, Sheets
Family
Series
TH832

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  • Buy the TH832-288-192-0.5 Penchem Technologies Sdn Bhd on Chip-Max Electronics(HongKong) Co.,Limited,we are Penchem Technologies Sdn Bhd Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the TH832-288-192-0.5 within 24 hours,please contact our sales team or send email to sundy@chip-max.com Hope we can cooperate in the future.
    Specifications
    SeriesTH832
    RoHSRoHS
    TypeGel Pad, Sheet
    ColorPink
    ShapeRectangular
    UsageThermally Conductive
    Outline288.00mm x 192.00mm
    AdhesiveTacky - Both Sides
    MaterialSilicone Gel
    Thickness0.0197" (0.500mm)
    Part StatusActive
    Backing, Carrier-
    Thermal Resistivity-
    Thermal Conductivity3.5W/m-K
    RFQ Email
    sundy@chip-max.com or Inquires online
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