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TH997-288-192-1.0
- Part Number
- TH997-288-192-1.0
- Manufacturer
- Penchem Technologies Sdn Bhd
- Description
- SOFT SILICONE THERMAL PAD
- Data sheet
- Category
- Thermal - Pads, Sheets
- Family
- Series
- TH997
Request a Quote
Buy the TH997-288-192-1.0 Penchem Technologies Sdn Bhd on Chip-Max Electronics（HongKong) Co.,Limited,we are Penchem Technologies Sdn Bhd Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the TH997-288-192-1.0 within 24 hours,please contact our sales team or send email to sundy@chip-max.com Hope we can cooperate in the future.
Specifications
| Series | TH997 |
|---|---|
| RoHS | RoHS |
| Type | Thermal Pad |
| Color | Blue |
| Shape | Rectangular |
| Usage | Thermally Conductive |
| Outline | 288.00mm x 192.00mm |
| Adhesive | Tacky - Both Sides |
| Material | Silicone |
| Thickness | 0.0394" (1.000mm) |
| Part Status | Active |
| Backing, Carrier | - |
| Thermal Resistivity | - |
| Thermal Conductivity | 2.4W/m-K |
- RFQ Email
- sundy@chip-max.com or Inquires online
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